Routes to 3D Electronics: IDTechEx Assess Technologies and Applications

BOSTON, April 1, 2020 /PRNewswire/ -- Metallization of 3D surfaces is a growing field with diverse applications. In this article, Dr Khasha Ghaffarzadeh, Research Director at IDTechEx, will briefly discuss some techniques and applications thereof. A More specifically, he will discuss and critically benchmark laser direct structuring (LDS), aerosol, 3D printed electronics (3DPE), two-shot molding and In-Mold Electronics (IME).
Routes to 3D Electronics: IDTechEx Assess Technologies and Applications
This article is based on the newly updated report "In-Mold Electronics 2020-2030: Technology, Market Forecasts, Players" which offers a detailed assessment of various techniques to obtain 3D-shaped circuits with a special focus on IME. This report from the global market research firm, offers a technical assessment of manufacturing processes and material requirements, market outlook for applications and players, and a study of competitive routes to 3D electronics.What drives these trends?Interconnects are often created in printed circuit boards (PCB). These PCBs can be made on flexible substrates, mainly PI, enabling the realization of thin, flexible, multilayer circuits. PI has a relatively high processing temperature which means that it is compatible with standard reflow processes. As such, the assembly process is similar to that found on common PCBs, e.g. FR4 based rigid PCBs.A  Furthermore, multilayer circuits can be achieved. As such, complex high-density circuits supporting all manners of IC packages can be realized.
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