Synopsys Design Platforms Enabled for Samsung Foundry 2.5D-IC Multi-Die Integration

Synopsys and Samsung Foundry Collaboration Delivers Customized Solution to Support 5G, AI, and HPC ApplicationsMOUNTAIN VIEW, California, Dec. 9, 2019 /PRNewswire/ --Highlights:

Synopsys Fusion Design Platform and Custom Design Platform support 7LPP SoCs and SUB20LPIN silicon interposer

Immediate foundry customer deployment through Samsung customized design flow

Synopsys, Inc. (Nasdaq: SNPS) today announced availability of design solutions to support Samsung Foundry's 2.5D-IC Multi-Die Integration (MDIa??) on its 7-nanometer (nm) LPP (Low Power Plus) with extreme ultraviolet (EUV) lithography technology, known as 7LPP. The Synopsys Fusion Design Platforma?? and Custom Design Platform enable quicker design prototyping and analysis to help designers address the time-to-market pressures associated with delivery to accelerating markets, such as 5G, artificial intelligence (AI), and high-performance computing (HPC)."Coupling noise between multi-die and package causes unexpected performance issues, and addressing 2.5D-IC system problems at later design stages is more difficult as design complexity increases," said Jung Yun Choi, vice president of Foundry Design Technology Team at Samsung Electronics. "Samsung Foundry's MDI design flow, which integrates analysis and implementation for early-stage system-level pathfinding, enables our customers to overcome performance issues and achieve cost-efficient 2.5D-IC products. Through our collaboration, customers can pull in their schedule and achieve a performance-driven product while reducing turnaround time for problem-solving."
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